项目Item	技术指标Technical parameter
最大加工面积MAX.Board Size 单面/双面板Single/Double Sided P.C.B	800*550
板厚Board Thickness	0.5mm-3.mm
最小线宽The Min.Track	0.1mm
最小间隙The Min Space	0.1mm
最小孔径Min Hole Size	0.3mm
孔壁厚度Hile Plating Tolerance PTH Thickness	>0.025mm
金属化孔孔径公差PTH .Tolerance	±0.075mm
非金属化孔孔径公差NPTH Tolerance	±0.05mm
孔位公差 Hole Position Tolerance	±0.05mm
外形尺寸公差Outine Demesion Tolerance	±0.15mm
绝缘电阻 Insulation Resistance
孔电阻Through Hole Resistance	<300U
抗电强度Dielectric Strength	>1.6kv/mm
耐电流Current Breakdown	10A
抗剥强度Peel-off Strength	1.5n/mm
阻焊剂硬度Solder Mask Abrasion	>5H
热冲击Thermal Stress
自熄性Inflammability	94vo
通断测试电压E-Test Voltage	10-250V
焊盘拉脱强度Pull of Stength of Peels	100N
可焊性Soder Ability
翘曲度Bow and Twist	<0.01mm/mm